Project Description
Product Specification of JD2552
(SP55 Microdisplay Die in Wafer Form)
1. INTRODUCTION
This is a general specification for Jasper Display Corp.’s JD2552 Microdisplay Die in Wafer Form Specification (HDTV resolution) for use in Liquid Crystal on Silicon (LCOS) microdisplay applications. Jasper Display Corp.’s high performance microdisplay die is a full digital backplane and is targeted for use in single and multi channel optical systems for amplitude and phase modulation applications.
The SP55 microdisplay die has an array diagonal of 0.55” and offers a total resolution of (1952×1112); an additional 32 columns and 32 rows have been added beyond normal HDTV resolution to allow for dynamic, convergence adjustment of the microdisplay component. Microdisplay manufactured using the JD2552 wafer are used with a companion OCM Controller ASIC.
2. FEATURES
- HDTV (1920 x 1080)
- Additional 32 columns and 32 rows for electronic alignment (for a total resolution of 1952×1112)
- 0.55” diagonal
- Up to 480 Hz color field rate (Support 120 Hz frame rate or above for HD Video)
- Up to 5V (adjustable) operation of Array for LC Performance
- LVCMOS compatible I/O interface for Speed and Low Power
- Controllable image border grayscale
- Single panel solution, optimized OCM Controller ASIC
- Amplitude and phase modulation applications
3. GENERAL SPECIFICATION
| Die Features | |
|---|---|
| Resolution (active) | 1920 x 1080 |
| Resolution (addressable) | 1952 x 1112 |
| Pixel Pitch | 6.4 um |
| Active Area | 12.5 mm x 7.1 mm |
| Die Size | 15.92 mm x 11.87 mm |
| Aperture Ratio | ≧93% |
| Reflectivity (aluminum only, 1400 – 2000 nm) | 94% |
| Die Planarity | <100nm |
| Dead Pixels per Die | None, Tested for 100% live Pixels |
| Wafer Features | |
| Wafer Diameter | 200.0 ± 0.50 mm |
| Wafer Thickness | 725 ± 15 µm |
| Wafer Orientation Mark | Notch |
| MTTF (design target) | >20,000 hours |
| Environmental Considerations -Operating | |
| Typical Operating Temperature | 40°C to 50°C |
| Extended Temperature Range | 10°C to 65°C |
| Humidity | 10% to 80%, non condensing |
| Environmental Considerations -Storage | |
| Temperature | -20°C to 70°C |
| Storage | In Dry Nitrogen sealed wafer carrier |