This is a general specification for Jasper Display Corp.’s JD2704 Microdisplay Die in Wafer Form Specification (4K2K resolution) for use in Liquid Crystal on Silicon (LCOS) microdisplay applications. Our high performance microdisplay die is a full digital backplane and is targeted for use in single and multi-channel optical systems for amplitude and phase modulation applications.
The Q4K70 microdisplay die has an array diagonal of 0.70” and offers a total resolution of 4160×2464; an additional 64 columns and 64 rows have been added beyond the 4K2K superset (4096×2400) to allow dynamic, convergence adjustment of the microdisplay component. Microdisplays manufactured using the JD2704 wafer are used with a companion driver board solution.
* Wafers are delivered with Wafer Maps of the Good Die.